Jewar (Uttar Pradesh)/New Delhi, February 21, 2026 — Prime Minister Narendra Modi today virtually laid the foundation stone for India Chip Pvt. Ltd., a ₹3,706 crore joint venture between HCL and Foxconn for an Outsourced Semiconductor Assembly and Test (OSAT) facility at the Yamuna Expressway Industrial Development Authority (YEIDA) in Jewar.
The plant, approved under the Government’s Modified Scheme for Semiconductor Assembly, Testing, Marking, and Packaging (ATMP), will play a key role in global supply chains for mobile phones, laptops, automotive electronics, consumer devices, and other high-tech products.
Addressing the event, PM Modi described the current decade as India’s “Tech-ade” and stressed the need to build both software and hardware capabilities simultaneously to power AI and modern technologies. He noted that electronics manufacturing in India has grown six-fold and mobile manufacturing 28 times in the last 11 years under the “Make in India” initiative.
Highlighting Uttar Pradesh’s remarkable transformation, the Prime Minister said that while the state was once in the news for the wrong reasons a decade ago, it is now celebrated for massive investments, factories, and its integration into the global semiconductor supply chain.
The facility is expected to create thousands of direct and indirect jobs for engineers, technicians, and ancillary industries in the region, while also promoting technology transfer and strengthening India’s semiconductor ecosystem.
The project marks a major milestone in India’s journey toward semiconductor self-reliance and positions Uttar Pradesh as a key hub in the global electronics value chain.
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